Cutting & Drilling
Automatic cutting lines and 32 CNC drilling machines (Datong / Dongtai) for high-accuracy, high-throughput hole formation.
Home / Capabilities
Every parameter below is verified on our production floor — from 3 mil fine lines to 8:1 aspect-ratio backplanes, all under one roof.
Engineering limits you can design to. For special requirements beyond this table, contact our engineering team.
| # | Item | Capability | # | Item | Capability |
|---|---|---|---|---|---|
| 1 | Minimum line width | 3 mil | 12 | Minimum solder dam | 4 mil |
| 2 | Minimum spacing | 3 mil | 13 | Insulation resistance | 1E+12 Ω (normal state) |
| 3 | Minimum hole diameter | 0.20 mm | 14 | Aspect ratio | 8 : 1 |
| 4 | Hole-wall copper | 0.6 – 2.8 mil | 15 | Thermal shock | 288 °C, 10 s × 3 passes |
| 5 | PTH tolerance | ±3 mil | 16 | Twist & bow | ≤ 0.7% |
| 6 | NPTH tolerance | ±2 mil | 17 | Electric strength | > 1.3 KV/mm |
| 7 | Hole position tolerance | ±3 mil | 18 | Peel strength | 1.4 N/mm |
| 8 | Outline tolerance | ±5 mil | 19 | Solder-mask hardness | ≥ 6H |
| 9 | Max panel size | 860 × 610 mm | 20 | Flammability | 94V-0 |
| 10 | Board thickness | 0.1 – 3.2 mm | 21 | Impedance control | ± 8% |
Surface finishes: HASL, lead-free HASL, immersion gold (ENIG), immersion tin, OSP, gold plating (hard gold / fingers).
Quick-turn samples from our dedicated drilling department — 32 CNC drilling machines running in parallel.
| Board Type | Sample Lead Time | Volume Lead Time |
|---|---|---|
| Double-sided | 2–3 days | 7–8 days |
| Multilayer | 5–6 days | 8–10 days |
| Special boards | 2 weeks | 2 weeks |
| HDI (high-density interconnect) | 2 weeks | 2 weeks |
Full In-House Process Flow
Every step of the double-sided and multilayer process happens inside our factories, monitored by ERP from engineering release to final packing.
Key machines from our production and quality lines.
Automatic cutting lines and 32 CNC drilling machines (Datong / Dongtai) for high-accuracy, high-throughput hole formation.
Parallel-light exposure (CCVT / Zhisheng), dry-film develop, DES and pattern-plating lines for 3 mil fine-line yield.
Vertical PTH and copper-plating lines, ENIG / immersion-tin / OSP lines with automatic dosing and bath analysis.
AOI (Ouvian), flying-probe and fixture e-test, impedance coupons on CMI-900 for every production lot.
High-speed placement with reflow, AOI and X-ray for BGA — supporting turnkey and consigned PCBA orders.
Automated horizontal lines for desmear, etch and OSP with ERP-traced process parameters on every panel.
Upload Gerber & BOM — engineering review and quotation back within 24 hours.