HDI (High Density Interconnect) boards pack more interconnections into less space by replacing mechanical drilled holes with laser microvias, fine lines and stacked or staggered via structures. If your product uses a BGA below 0.4 mm pitch, a mobile-class SoC, or a module that simply will not fit on a conventional multilayer board, HDI is the process you need.
Xianglong Circuit builds 1-nth, 2-nth and 3-nth order HDI boards in Shenzhen and Dongguan, from 4 to 26+ layers. Our lines support 0.10 mm laser-drilled microvias, 0.20 mm mechanical drilling, 3 mil (75 um) minimum line and space, via-in-pad with epoxy fill and copper capping, and controlled impedance within +-8%. Stackups are engineered around Tg150-180 FR-4 and mid-loss materials, and every build receives a free DFM review before production.
We are an ISO 9001 certified, UL recognized manufacturer operating since 2008, with 300+ staff, 53 CNC drilling machines and monthly capacity of 60,000 square meters across two plants. AOI, X-ray and flying probe inspection run on every batch.
Send Gerber, drill and stackup files to info@xl-pcb.com - you will get an engineering-reviewed DFM report and quotation within 24 hours. Prototypes ship in 2-3 days, volume in 10-15 days.
| Layer count | 4 - 26+ layers |
| Build-up order | 1st, 2nd and 3rd order HDI |
| Laser microvia | down to 0.10 mm |
| Mechanical via | down to 0.20 mm |
| Min line / space | 3 mil / 3 mil (75 um) |
| Via-in-pad | epoxy fill + copper cap |
| Aspect ratio | up to 8:1 |
| Materials | FR-4 Tg150-180, mid-loss / low-loss laminates |
| Surface finish | ENIG, OSP, immersion silver |
| Impedance control | +-8% (10% optional) |
An HDI board uses laser-drilled microvias and finer lines than conventional PCBs to connect high pin-count components such as 0.4 mm-pitch BGAs and application processors. You typically need HDI when routing density exceeds what through-hole multilayer can handle, or when board size must shrink.
We support 1-nth, 2-nth and 3-nth order build-ups, stacked and staggered microvias, skip vias, and via-in-pad with epoxy fill and copper capping for BGA thermal or routing escape needs.
Gerber (RS-274X) or ODB++, drill files, a proposed stackup, and the impedance requirements. If the stackup is undecided, our engineers will propose one and mark it in the DFM report.
MOQ starts from 5 pieces. Quick-turn HDI prototypes ship in 3-5 working days depending on build-up order; volume production runs 10-15 days.
