Multilayer HDI
10-layer HDI, 1.6 mm finished thickness, 3 mil line/space with blind vias — the workhorse for industrial control and communication equipment.
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From bare boards to fully assembled electronics — every product is built in-house and inspected to IPC-A-600 / IPC-A-610 standards.
Multilayer / High-Tg → · HDI PCB → · High-Frequency / RF → · Metal Core →
High-precision double-sided, multilayer, metal-base and special-material boards for demanding applications.
10-layer HDI, 1.6 mm finished thickness, 3 mil line/space with blind vias — the workhorse for industrial control and communication equipment.
26-layer rigid-flex boards, 4.0 mm thick, 5.5/4.5 mil line/space — replacing connectors and cables in compact, high-reliability devices.
8-layer 1.2 mm board combining second-order HDI with rigid-flex construction, 0.12 mm laser-filled vias — engineered for medical devices.
6-layer, 1.2 mm high-Tg board with ENIG surface and gold-finger edge connectors, 0–0.1 mm hole annular ring tolerance for automotive radar and telematics.
Large-format power-supply boards on high-frequency substrates, 8-layer 3.0 mm, 10/8 mil line/space — built for energy metering and power electronics.
3-layer antenna boards on Rogers Ro4730G3 high-frequency laminate with hybrid pressing — optimized for base-station and mmWave antenna arrays.
PCB bare boards pass through SMT placement or DIP insertion to become finished assemblies — fully tested and ready for your enclosure.
Payment-terminal boards with security-critical BGA placement, conformal coating and full functional test.
Car infotainment mainboards assembled with high-pin-count processors, validated for vibration and thermal stress.
Panelized 4G communication modules with RF shielding and consistent solder-joint quality for volume IoT deployment.
High-reliability board cards for instrumentation, aerospace-adjacent and rugged industrial systems.
Wi-Fi router and network-equipment boards with controlled-impedance RF sections.
Consumer projector driver boards — SMT + DIP mixed assembly with in-circuit and burn-in testing.
Polyimide- and polyester-based flex circuits offering high wiring density, light weight, thin profile and superior bendability for dynamic and space-constrained designs.
With PI stiffeners and SMT pads for camera and display modules.
Shielded multilayer flex for high-speed signal transmission.
Designed for millions of bend cycles in hinges and moving parts.
Any-shape outline, ZIF and board-to-board interconnects.
Send your Gerber files, BOM and specification — we'll return a DFM report and quote within 24 hours.