Above a few hundred megahertz, ordinary FR-4 stops behaving: dielectric loss climbs, impedance wanders, and antenna efficiency collapses. High-frequency boards built on PTFE, ceramic-filled hydrocarbon or low-loss glass laminates keep the signal honest - provided the fabricator controls Dk, resin content and copper roughness as tightly as it controls lines and spaces.
Xianglong Circuit manufactures RF and microwave boards on Rogers 4003C / 4350B / 5880, Taconic RF-35 and pure PTFE families, including hybrid stackups that bond a Rogers RF layer to low-cost FR-4 power planes. Dk is held within +-0.05 lot-to-lot, impedance to +-8%, and 0.5 oz - 3 oz copper is etched to 3 mil geometry for mmWave feed networks, GNSS, 5G small-cell and radar boards.
Phase-sensitive designs get foil-to-laminate matching and press-cycle documentation in the DFM report; every RF batch is impedance-coupons tested and the results shipped with the boards. ISO 9001 certified, UL recognized, two plants, exporting since 2008.
Send Gerber, the stackup target and your frequency bands - our RF engineers will verify material choice, return a DFM report and quote within 24 hours.
| Laminates | Rogers 4003C / 4350B / 5880, Taconic, PTFE |
| Hybrid stackups | RF layer bonded to FR-4 power cores |
| Dk control | +-0.05 lot-to-lot |
| Impedance control | +-8% (10% optional) |
| Layer count | 2 - 20+ layers |
| Copper | 0.5 - 3 oz, low-profile foil options |
| Min line / space | 3 mil / 3 mil |
| Surface finish | ENIG, immersion silver |
As a rule: below 1 GHz, high-Tg FR-4 often works; 1-10 GHz suits Rogers 4003C or Taconic RF-35; above 10 GHz or for mmWave, 4350B, 5880 or pure PTFE. Hybrid stackups cut cost by keeping only the RF layers expensive - we size it in DFM against your bands.
Antenna tuning and filter response assume the datasheet Dk. If the laminate drifts, every board detunes the same way. We purchase against Dk windows of +-0.05 and document press cycles so your prototypes match volume production.
Yes - hybrid builds bond RF laminates to FR-4 cores for power and digital planes, cutting cost 30-50% versus all-Rogers stacks. We handle the lamination and CTE mismatch engineering.
Every production panel includes impedance coupons measured on a TDR; results ship with the batch, and phase-sensitive designs can request full micro-section reports.
