Rigid-flex boards bond flexible polyimide layers between rigid FR-4 sections, so a complete 3D electronics package folds from a single panel - no ribbon cables, no connector pairs, no solder joints to fail in the field. Aerospace, medical, automotive and industrial modules choose rigid-flex when reliability per gram beats every alternative.
Xianglong Circuit builds 4-18 layer rigid-flex stacks with 1-4 flex cores of 25 um polyimide, controlled-impedance flex routing at +-8%, and dynamic bend capability engineered to 10:1 radius. Air-gap and adhesiveless constructions are available for demanding flex-life or thermal requirements, and every design passes a joint DFM review covering fold sequence, stiffener placement and assembly carriers.
Because the whole board is made in-house - flex lamination, rigid bonding, drilling, plating and ENIG on the same ISO 9001 certified lines - lead times stay at 10-15 days for prototypes and the flex-to-rigid transition zones are inspected by X-ray and micro-section on every batch.
Send your Gerber or an outline sketch with the fold drawing; our engineers will propose the stackup, bend radius and panelization, and return a firm quotation within 24 hours.
| Total layers | 4 - 18 layers |
| Flex cores | 1 - 4 layers, PI 25 um |
| Rigid sections | FR-4 Tg150-180 |
| Min line / space (flex) | 3 mil / 3 mil |
| Bend capability | 10:1 dynamic radius, engineered stackup |
| Impedance control | +-8% on flex and rigid layers |
| Surface finish | ENIG on rigid + flex zones |
| Inspection | X-ray + micro-section on transitions |
Once a design needs 3+ flex-to-rigid interconnects, reliability matters, or space is premium, rigid-flex usually wins on total cost: connectors, cable assembly and assembly labor disappear, and field failure rates drop. Below that threshold a loose flex may be cheaper - send us the outline and we will compare both honestly.
Dynamic applications are engineered to a 10:1 radius with adhesiveless flex cores and neutral-axis copper; static folds can be tighter. The exact number is fixed in DFM against your fold sequence.
We panelize rigid-flex on SMT carriers so rigid zones stay flat during placement and reflow, then depanel. Turnkey component sourcing and functional test are available.
Gerber per layer (or ODB++), the flex outline and fold drawing, stackup target, and impedance spec. A sketch plus requirements is enough to start a stackup proposal.
