A multilayer PCB laminates three or more conductive layers with prepreg in between, then connects them with plated through holes. Once a design needs more than two routing layers — routers, industrial controllers, power supplies, base station boards or any product with a dense BGA escape — a multilayer build-up becomes the cheapest way to fit the circuit.
Xianglong Circuit builds 4 to 26+ layer rigid boards, with 14 and 20 layer stackups in routine production. Our process window covers 3 mil line and space, 0.20 mm minimum drilled holes, an 8:1 aspect ratio, board thickness from 0.1 mm to 3.2 mm and a maximum panel of 860 x 610 mm. Impedance on controlled lines is held within ±8%, verified by coupon test on every panel.
Laminates are selected against your assembly process: standard FR-4 at Tg 150-180 for lead-free reflow, and high-Tg FR-4 where the board sees multiple reflow cycles or a hot operating environment. Copper weight above 2 oz is reviewed case by case before quotation so plating and etching limits are agreed up front instead of discovered in production.
We have manufactured in Shenzhen since 2008 and added a second plant in Dongguan in 2021 — 300+ staff, 53 CNC drilling machines and 60,000 square meters of monthly capacity. Every batch goes through AOI, X-ray and flying probe inspection before shipment, under ISO 9001 and UL with IPC-A-600 Class 2/3 acceptance.
Send Gerber or ODB++ files, your stackup preference and copper weight to info@xl-pcb.com. You will receive an engineering-reviewed DFM report and a quotation within 24 hours; multilayer samples ship in 5-6 working days and volume in 8-10 days.
| Layer count | 4 - 26+ layers (14 / 20 layer routine) |
| Min line / space | 3 mil / 3 mil (75 um) |
| Min drilled hole | 0.20 mm |
| Aspect ratio | up to 8:1 |
| Board thickness | 0.1 - 3.2 mm |
| Max panel size | 860 x 610 mm |
| Hole-wall copper | 0.6 - 2.8 mil |
| Impedance control | ±8% (10% optional) |
| Laminate | FR-4 Tg150-180, high-Tg FR-4 |
| Surface finish | ENIG, HASL, OSP, immersion silver |
| Flammability | 94V-0 |
| Sample / volume lead time | 5-6 days / 8-10 days |
We produce 4 to 26+ layer rigid boards. 14 and 20 layer stackups are routine; above 26 layers the build-up is reviewed by our engineering team before quotation so drill, lamination and registration limits are confirmed first.
If your board routes with through-hole vias only, multilayer is cheaper and faster. When the design needs microvias, via-in-pad or 0.4 mm-pitch BGA escape, HDI is the right process - see our HDI PCB page for the build-up options.
Copper above 2 oz is quoted case by case. We confirm plating capability, minimum trace and gap after etch compensation, and solder-mask behaviour before accepting the order, so the quoted spec is the spec we ship.
Gerber (RS-274X) or ODB++, drill files, the layer stackup and copper weight, surface finish, and any impedance requirements. If the stackup is not defined, our engineers propose one and highlight the changes in the DFM report.
Multilayer samples ship in 5-6 working days and volume orders in 8-10 working days after DFM confirmation, per the standard schedule on our capabilities page. Expedited slots depend on current line loading.
